深加工玻璃

Circle and triangle micro – through – hole arrays without cracks, chips, and debris were machined in 0.3 – mm – thick quartz glass by picosecond laser (wavelength = 1064 nm, pulse width ~ 12 ps) in air ambient. The diameter of each circle through – hole was 550 μm, and the side length of each triangle hole is 500 μm; 30 μm spacing between the adjacent hole edges and the smooth machined surface with Ra = 0.8 μm roughness depicted the high precision of the high – density micro – through – hole arrays.

Researchers used a high – average – power and high – pulse – repetition – rate picosecond laser to mill and cut borosilicate glass plates. They optimized laser processing parameters for efficient direct material ablation and employed water – assisted ablation to improve the ablation efficiency and the cutting speed of borosilicate glasses. The laser process was realised through a thin flowing water film, which was formed by spraying water mist on the surface of the workpiece. Under optimal parameters, the cutting speed of 420 – μm – thick glass plates increased nearly ten times – from 0.52 to 5 mm/s.

Femtosecond laser material processing (FLMP) was used to fabricate a 3D reservoir micromodel in a borosilicate glass substrate. The micromodel featured 4 different depths—35, 70, 140, and 280 µm, over a large surface area (20 mm × 15 mm). This study shows the capability and robustness of FLMP to machine 3D multi – depth features that will be essential for the development, control, and fabrication of complex microfluidic geometries.